BAT54V
Document number: DS30560 Rev. 5 - 2
1 of 3
www.diodes.com
July 2008
? Diodes Incorporated
BAT54V
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
Features
?
Low Forward Voltage Drop
?
Fast Switching
?
Ultra-Small Surface Mount Package
?
PN Junction Guard Ring for Transient and ESD Protection
?
Lead Free By Design/RoHS Compliant (Note 1)
?
"Green” Device (Note 2)
Mechanical Data
?
Case: SOT-563
?
Case Material: Molded Plastic, "Green" Molding Compound. UL
Flammability Classification Rating 94V-0
?
Moisture Sensitivity: Level 1 per J-STD-020D
?
Terminal Connections: See Diagram
?
Terminals: Finish ?
Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
?
Marking Information: See Page 3
?
Ordering Information: See Page 3
?
Weight: 0.003 grams (approximate)
C1
A1
NC
NC
A2
C2
Top View
Bottom View
Device Schematic
Maximum Ratings
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
30
V
Forward Continuous Current (Note 3)
IF
200
mA
Repetitive Peak Forward Current (Note 3)
IFRM
300
mA
Forward Surge Current (Note 3) @ t < 1.0s
IFSM
600
mA
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 3)
PD
150
mW
Thermal Resistance, Junction to Ambient Air (Note 3)
RθJA
833
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +125
°C
Electrical Characteristics
@TA
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 4)
V(BR)R
30
?
?
V
IR
= 100
μA
Forward Voltage
VF
?
?
240
320
400
500
1000
mV
IF
= 0.1mA
IF
= 1mA
IF
= 10mA
IF
= 30mA
IF
= 100mA
Reverse Leakage Current (Note 4)
IR
?
?
2.0
μA
VR
= 25V
Total Capacitance
CT
?
?
10
pF
VR
= 1.0V, f = 1.0MHz
Reverse Recovery Time
trr
?
?
5.0
ns
IF
= 10mA through I
R
= 10mA
to IR
= 1.0mA, R
L
= 100
Ω
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our w
ebsite at http://www.diodes.com/datasheets/ap02001.pdf. TA
= 25°C.
4. Short duration pulse test used to minimize self-heating effect.
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